Engineering is key to every opportunity that presents itself to Sellectronics, having a multi-skilled and flexible engineering team from the top-down has proven we are best in class for technology and electronic manufacturing practices.
• BGA & µBGA (0.2mm)
• Passive devices down to 01005
• HDI PCB Subtrates
• Flex-Rigid PCB’s
• Package on Package (PoP)
• Full Turnkey (FTK) Solution
• Free Issue (FI) of materials
• Part FI, part procurement
• IPC-A-610 Trained Operators
• IPC-J-STD-001 Trained Operators
• Re-work (BGA’s)
• First Article Inspection Reports (FAIRs)
• Short lead-time on Free Issue Kits
• Component placement down to 01005
• Supply Chain Management
• New Product Introduction
• Rapid Prototyping
• PCB Assembly – Surface Mount & Thru Hole Assembly
• PCB Cleaning
• Cable & Loom Assembly
• Inspection & Test Solutions
• Conformal Coating
• Box Build Assembly
